Company Filing History:
Years Active: 2017
Title: Innovations of Jen-Hau Cheng in Flexible Thermal Ground Planes
Introduction
Jen-Hau Cheng is an accomplished inventor based in Boulder, CO (US). He has made significant contributions to the field of thermal management through his innovative designs and patents. His work focuses on developing flexible thermal ground planes that enhance the efficiency of thermal systems.
Latest Patents
Jen-Hau Cheng holds a patent for a "Flexible thermal ground plane and manufacturing the same." This patent describes methods, apparatuses, and systems for creating flexible thermal ground planes. The design includes a support member and features multiple evaporator and condenser regions that couple with the support member. These regions may incorporate microwicking and nanowicking structures, enhancing their thermal management capabilities. The innovative use of nanorods and nanomesh further improves the efficiency of the thermal ground plane.
Career Highlights
Cheng is currently associated with Kelvin Thermal Technologies, Inc., where he continues to push the boundaries of thermal technology. His work has garnered attention for its potential applications in various industries, including electronics and aerospace.
Collaborations
Throughout his career, Jen-Hau Cheng has collaborated with notable colleagues, including Ronggui Yang and Yung-Cheng Lee. These partnerships have contributed to the advancement of thermal management technologies and have fostered a collaborative environment for innovation.
Conclusion
Jen-Hau Cheng's contributions to the field of flexible thermal ground planes exemplify the importance of innovation in thermal management. His patent and ongoing work at Kelvin Thermal Technologies, Inc. highlight his commitment to advancing technology in this critical area.