Kelvin Thermal Technologies, Inc.

Jen- Hau Cheng

Ronggui Yang

Yung-Cheng Lee

Victor M Bright

Chen Li

Christopher Oshman

Bo Shi

George P Peterson

Methods, apparatuses, and systems are disclosed for flexible thermal ground planes. A flexible thermal ground plane may include a support member. The flexible thermal ground plane may include an evaporator region or multiple evaporator regions configured to couple with the support member. The flexible thermal ground plane may include a condenser region or multiple condenser regions configured to couple with the support member. The evaporator and condenser region may include a microwicking structure. The evaporator and condenser region may include a nanowicking structure coupled with the micro-wicking structure, where the nanowicking structure includes nanorods. The evaporator and condenser region may include a nanomesh coupled with the nanorods and/or the microwicking structure. Some embodiments may include a micromesh coupled with the nanorods and/or the microwicking structure.

Flexible thermal ground plane and manufacturing the same

Growing community of inventors

Boulder, CO, United States of America

Jen- Hau Cheng