This inventor holds 1 USPTO granted patent. Top assignee: Globalfoundries Inc.. Active years: 2020.
Company Filing History:
Years Active: 2020
Title: The Innovations of Jeffrey B. Riendeau
Introduction
Jeffrey B. Riendeau is an accomplished inventor based in Ballston Lake, NY (US). He has made significant contributions to the field of semiconductor manufacturing through his innovative patent. His work focuses on enhancing the efficiency and accuracy of failure analysis in integrated circuit chip production.
Latest Patents
Jeffrey holds a patent titled "System and method for performing failure analysis using virtual three-dimensional imaging." This patent describes a system and method that performs in-line optical inspection during the manufacturing of integrated circuit chips on a semiconductor wafer. The process involves acquiring a two-dimensional (2D) image of a specific area on the wafer to confirm and classify defects. The 2D image is then transformed into a virtual three-dimensional (3D) image, ensuring accuracy through techniques that assess surface topography based on material-specific image intensity information. This innovative approach allows for significantly faster in-line failure analysis, enabling real-time advanced process control (APC).
Career Highlights
Jeffrey B. Riendeau has dedicated his career to advancing semiconductor technology. He is currently associated with GlobalFoundries Inc., where he continues to contribute to the field through his expertise and innovative solutions. His work has been instrumental in improving manufacturing processes and enhancing product quality.
Collaborations
Throughout his career, Jeffrey has collaborated with notable professionals in the industry, including Jian Qiu and Kok Hin Teo. These collaborations have further enriched his work and contributed to the development of cutting-edge technologies in semiconductor manufacturing.
Conclusion
Jeffrey B. Riendeau's innovative contributions to semiconductor manufacturing, particularly through his patent on virtual three-dimensional imaging for failure analysis, highlight his significant role in the industry. His work not only improves manufacturing efficiency but also sets a precedent for future advancements in the field.