Jeffery A Dean

Title: Jeffery A. Dean and His Printed Wiring Board Patents.

Introduction

Jeffery A. Dean is an inventor based in Clermont, Florida, whose patent work includes printed wiring board technology. His inventions address thermal management and radio-frequency component integration in electronic assemblies. Dean is associated with Lockheed Martin Corporation and holds 6 patents.

Latest Patents

Dean’s listed patents focus on wiring boards with engineered metallization layers and methods for manufacturing them.

“Wiring board having an engineered metallization layer” describes a printed wiring board built from a first substrate and alternating layers of a second substrate and metal. Its thick composite metal layer is designed with a configurable coefficient of thermal expansion to match radio-frequency components. The layer also helps dissipate heat generated by those components and serves as a ground plane.

“Method of making a wiring board having an engineered metallization layer” covers a manufacturing method for a similar board structure. The engineered composite metallization is intended to provide thermal expansion matching, heat dissipation, and a ground plane for radio-frequency components.

Career Highlights

Dean’s patent portfolio reflects work on electronic packaging and printed circuit board design. The described inventions combine material engineering with practical board functions, including thermal control and electrical grounding. His work is associated with Lockheed Martin Corporation.

Collaborations

William Scott McKinley and Steve Todd Nicholas are identified as Dean’s coworkers. The available information does not specify their roles in the listed patents or the nature of any collaboration.

Conclusion

Jeffery A. Dean’s patents address engineered metallization for printed wiring boards, with an emphasis on matching thermal expansion, dissipating heat, and supporting radio-frequency components.