The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 21, 2012
Filed:
Nov. 06, 2007
William S. Mckinley, Clermont, FL (US);
Steve T. Nicholas, Groveland, FL (US);
Jeffery A. Dean, Clermont, FL (US);
William S. McKinley, Clermont, FL (US);
Steve T. Nicholas, Groveland, FL (US);
Jeffery A. Dean, Clermont, FL (US);
Lockheed Martin Corporation, Bethesda, MD (US);
Abstract
The present invention relates to a method of manufacturing a printed wiring board (PWB) of the type depicted in FIG.. Such a PWB comprises a first substrate and alternating layers of a second substrate and a metal layer. The layermetallization of the PWB is a thick layer of a composite engineered metal material having a configurable coefficient of thermal expansion (CTE) to provide CTE matching with respect to radio frequency (RF) components mounted on the PWB, and having substantial heat dissipation properties to dissipate heat generated by the RF components. This composite metal layer also provides a ground plane for the RF components.