Jeff Waksman

Title: Jeff Waksman: Innovator in Semiconductor Manufacturing

Introduction

Jeff Waksman is a notable inventor based in Washington, DC. He has made significant contributions to the field of semiconductor manufacturing, particularly through his innovative patent.

Latest Patents

Waksman's most recent patent is titled "Rapid oxide etch for manufacturing through dielectric via structures." This invention involves a method for forming through dielectric via (TDV) openings of varying depths in a bonded structure. The process utilizes a single anisotropic etch with fluorine-deficient species derived from the dissociation of fluorocarbon-containing molecules. This advancement is crucial for enhancing the efficiency and effectiveness of semiconductor manufacturing.

Career Highlights

Jeff Waksman is currently employed at International Business Machines Corporation, commonly known as IBM. His work at IBM has allowed him to be at the forefront of technological advancements in the semiconductor industry. With a total of 1 patent, Waksman has demonstrated his capability as an inventor and innovator.

Collaborations

Throughout his career, Waksman has collaborated with talented individuals such as Sebastian Ulrich Engelmann and Li-Wen Hung. These collaborations have contributed to the development of cutting-edge technologies in the field.

Conclusion

In summary, Jeff Waksman is a distinguished inventor whose work in semiconductor manufacturing has led to significant innovations. His contributions continue to impact the industry positively.