The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 30, 2019
Filed:
Jun. 02, 2017
Applicant:
International Business Machines Corporation, Armonk, NY (US);
Inventors:
Sebastian U. Engelmann, White Plains, NY (US);
Li-Wen Hung, Mahopac, NY (US);
Eric Joseph, White Plains, NY (US);
Eugene O'Sullivan, Nyack, NY (US);
Jeff Waksman, Washington, DC (US);
Cornelia Tsang Yang, Medford, MA (US);
Assignee:
International Business Machines Corporation, Armonk, NY (US);
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 21/822 (2006.01); H01L 27/06 (2006.01); H01L 23/48 (2006.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76898 (2013.01); H01L 21/8221 (2013.01); H01L 23/481 (2013.01); H01L 23/5227 (2013.01); H01L 27/0688 (2013.01);
Abstract
After bonding a second substrate to a first substrate through a bonded material layer to provide a bonded structure, through dielectric via (TDV) openings of different depths are concurrently formed in the bonded structure by performing a single anisotropic etch using fluorine-deficient species that are obtained by dissociation of fluorocarbon-containing molecules.