Company Filing History:
Years Active: 2003-2004
Title: Innovations by Jeff Gasparitsch
Introduction
Jeff Gasparitsch is an accomplished inventor based in Fremont, California. He has made significant contributions to the field of chemical mechanical planarization (CMP) systems. With a total of two patents to his name, Gasparitsch has demonstrated his expertise and innovative spirit in the semiconductor industry.
Latest Patents
Gasparitsch's latest patents include an "Apparatus for controlling leading edge and trailing edge polishing." This invention features a platen designed to apply a controlled fluid flow to a linear polishing pad. The platen is equipped with a leading zone and a trailing zone, each containing output holes that can be independently controlled. This design enhances the efficiency of the polishing process in CMP systems.
Another notable patent is the "Conditioning mechanism in a chemical mechanical polishing apparatus for semiconductor wafers." This invention outlines a method and apparatus for conditioning a polishing pad. The process involves cycling a polishing member through the apparatus and conditioning it with a specialized member. The apparatus includes an end effector that can move both horizontally and vertically, along with a strain gauge to monitor the force applied to the polishing member.
Career Highlights
Gasparitsch is currently employed at Lam Research Corporation, a leading company in the semiconductor equipment industry. His work focuses on advancing technologies that improve the efficiency and effectiveness of semiconductor manufacturing processes.
Collaborations
Throughout his career, Gasparitsch has collaborated with notable colleagues, including Erik H Engdahl and Michael R Vogtmann. These partnerships have contributed to the development of innovative solutions in the field.
Conclusion
Jeff Gasparitsch's contributions to the semiconductor industry through his patents and work at Lam Research Corporation highlight his role as a key innovator. His inventions continue to influence the efficiency of chemical mechanical polishing processes.
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