Daejeon, South Korea

Jee Hyeon Hwang

This inventor holds 1 USPTO granted patent. Top assignee: Lg Chem, Ltd. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jee Hyeon Hwang. Retrieved from https://idiyas.com/inventor/jee-hyeon-hwang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank

% Patents Active = 100.0

Average Co-Inventor Count = 6.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: The Innovations of Jee Hyeon Hwang

Introduction

Jee Hyeon Hwang is a notable inventor based in Daejeon, South Korea. He has made significant contributions to the field of printed circuit board technology. His work focuses on enhancing the performance and reliability of multilayer printed circuit boards.

Latest Patents

Hwang holds a patent for an "Insulating layer for multilayer printed circuit board, multilayer printed circuit board comprising same, and method for producing same." This patent describes an insulating layer that includes a polymer resin layer containing a melamine derivative. This innovative approach allows for excellent adhesion to a patterned metal layer, which is crucial for the functionality of multilayer printed circuit boards.

Career Highlights

Jee Hyeon Hwang is currently employed at LG Chem, Ltd., a leading company in the chemical and materials industry. His work at LG Chem has allowed him to develop cutting-edge technologies that contribute to advancements in electronic components.

Collaborations

Hwang collaborates with talented colleagues, including Jeong Wook Mun and Kong Kyeom Kim. Their combined expertise fosters a creative environment that drives innovation in their projects.

Conclusion

Jee Hyeon Hwang's contributions to the field of printed circuit boards exemplify the importance of innovation in technology. His patent and work at LG Chem highlight his role as a key player in advancing electronic materials.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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