The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 27, 2025
Filed:
Sep. 25, 2020
Applicant:
Lg Chem, Ltd., Seoul, KR;
Inventors:
Jeong Wook Mun, Daejeon, KR;
Kong Kyeom Kim, Daejeon, KR;
Woo Jae Jeong, Daejeon, KR;
Jee Hyeon Hwang, Daejeon, KR;
Eun Byurl Cho, Daejeon, KR;
Jeong Hyuk Ahn, Daejeon, KR;
Assignee:
LG CHEM, LTD., Seoul, KR;
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/11 (2006.01); C07D 251/48 (2006.01); C07D 251/54 (2006.01); C08G 73/10 (2006.01); G03F 7/038 (2006.01); G03F 7/09 (2006.01); G03F 7/36 (2006.01); G03F 7/40 (2006.01); H05K 1/03 (2006.01); H05K 3/46 (2006.01);
U.S. Cl.
CPC ...
G03F 7/11 (2013.01); C07D 251/48 (2013.01); C07D 251/54 (2013.01); C08G 73/1092 (2013.01); G03F 7/094 (2013.01); G03F 7/36 (2013.01); G03F 7/40 (2013.01); H05K 1/036 (2013.01); H05K 3/4652 (2013.01);
Abstract
The present disclosure provides an insulating layer for a multilayer printed circuit board, a multilayer printed circuit board including the same, and a method for fabricating the same. The insulating layer of the present disclosure includes a polymer resin layer containing a melamine derivative, and thus may have excellent adhesion to a patterned metal layer.