Company Filing History:
Years Active: 1999-2010
Title: Innovations of Jean-Yves Robic
Introduction
Jean-Yves Robic is a notable inventor based in Grenoble, France. He has made significant contributions to the field of lithography, particularly in the development of reflection lithography masks. With a total of 4 patents to his name, Robic's work has advanced the technology used in various applications.
Latest Patents
One of his latest patents is titled "Structure of a lithography mask." This invention relates to a reflection lithography mask that comprises a substrate with a reflector coating and a stack made up of an etching barrier layer and an absorbing layer. The stack covers only a part of the reflector coating, and the absorbing layer is made solely of dielectric material, specifically HfO. This material allows for a reduction in the thickness of the mask pattern, thereby decreasing the shadow region during mask exposure. The invention is particularly applicable to reflection lithography.
Another significant patent is "Structure for a reflection lithography mask and method for making same." This invention concerns a structure for a lithographic reflection mask that includes a receive medium on which a reflector is fixed. The reflector includes at least one layer and is attached to the receive medium in a reverse manner relative to a manufacturing medium on which it was previously manufactured.
Career Highlights
Throughout his career, Jean-Yves Robic has worked with prominent organizations, including the Commissariat à l'Énergie Atomique and the French State. His expertise in lithography has positioned him as a key figure in the development of advanced technologies in this field.
Collaborations
Robic has collaborated with notable colleagues such as Bernard Aspar and Etienne Quesnel. Their combined efforts have contributed to the advancement of lithographic technologies.
Conclusion
Jean-Yves Robic's innovations in lithography have made a significant impact on the industry. His patents reflect a deep understanding of the technical challenges in this field and offer solutions that enhance the efficiency of lithographic processes.