San Jose, CA, United States of America

Jay Dholakia

This inventor holds 1 USPTO granted patent. Top assignee: Sandisk Technologies Inc.. Active years: 2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jay Dholakia. Retrieved from https://idiyas.com/inventor/jay-dholakia

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 8.0

ph-index = 1

Forward Citations = 1(Granted Patents)


Company Filing History:


Years Active: 2021

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1 patent (USPTO):Explore Patents

Title: The Innovative Contributions of Jay Dholakia

Introduction

Jay Dholakia is a notable inventor based in San Jose, California. He has made significant contributions to the field of semiconductor technology. His work has led to advancements that enhance the efficiency and reliability of semiconductor devices.

Latest Patents

Dholakia holds a patent for a semiconductor device that includes fractured semiconductor dies. This innovative design involves scoring a wafer in a series of parallel scribe lines, which allows for the controlled fracturing of semiconductor dies. The process ensures that any potential electrical shorts that may occur during the die fracture can be cleared by running a current through the electrical traces.

Career Highlights

Dholakia is currently employed at SanDisk Technologies Inc., where he continues to push the boundaries of semiconductor technology. His expertise and innovative mindset have made him a valuable asset to the company.

Collaborations

Throughout his career, Dholakia has worked alongside talented individuals such as Daniel Joseph Linnen and Kirubakaran Periyannan. These collaborations have fostered an environment of creativity and innovation.

Conclusion

Jay Dholakia's contributions to semiconductor technology exemplify the impact of innovative thinking in the field. His patent and work at SanDisk Technologies Inc. highlight his commitment to advancing technology for the future.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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