The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 07, 2021
Filed:
Mar. 03, 2020
Sandisk Technologies Llc, Addison, TX (US);
Daniel Linnen, Naperville, IL (US);
Kirubakaran Periyannan, Santa Clara, CA (US);
Jayavel Pachamuthu, San Jose, CA (US);
Narendhiran Cr, Bangalore, IN;
Jay Dholakia, San Jose, CA (US);
Everett Lyons, IV, San Jose, CA (US);
Hoang Huynh, San Jose, CA (US);
Dat Dinh, San Jose, CA (US);
SanDisk Technologies LLC, Plano, TX (US);
Abstract
A fractured semiconductor die is disclosed, together with a semiconductor device including the fractured semiconductor die. During fabrication of the semiconductor dies in a wafer, the wafer may be scored in a series of parallel scribe lines through portions of each row of semiconductor dies. The scribe lines then propagate through the full thickness of the wafer to fracture off a portion of each of the semiconductor dies. It may happen that electrical traces such as bit lines in the memory cell arrays short together during the die fracture process. These electrical shorts may be cleared by running a current through each of the electrical traces.