Javier A Delacruz

Title: **Javier A. Delacruz: Innovator in Microelectronic Assembly**

Introduction

Javier A. Delacruz, based in Santa Clara, California, is a noteworthy inventor with a commendable portfolio of seven patents. His contributions to the field of microelectronics underscore his role as a forward-thinking innovator, focusing on cutting-edge technologies that enhance electronic assemblies.

Latest Patents

Among his latest inventions are two significant patents that demonstrate his expertise in microelectronic assembly. The first, titled "Bonding of Laminates with Electrical Interconnects," describes a microelectronic assembly comprising first and second laminated microelectronic elements. It features a patterned bonding layer on each of these elements, facilitating mechanical and electrical bonding to form a cohesive assembly. The second patent, "Stacked Transmission Line," presents a stacked, multi-layer transmission line design that includes at least a pair of conductive traces. Each trace is equipped with multiple conductive stubs, which are electrically coupled and arranged in separate spatial layers, enhancing the functionality and performance of the transmission line.

Career Highlights

Javier A. Delacruz's career is marked by his position at Adeia Semiconductor Bonding Technologies Inc., a company that specializes in innovative semiconductor bonding solutions. His deep understanding of microelectronic systems has enabled him to contribute profoundly to the advancements in this field. His patents reflect a commitment to creating efficient and reliable electronic assemblies.

Collaborations

Throughout his career, Javier has collaborated with talented colleagues, including Belgacem Haba and Shaowu Huang. These collaborations have played a crucial role in driving innovation within his projects, showcasing the power of teamwork in technological advancements.

Conclusion

In conclusion, Javier A. Delacruz stands out as a prominent inventor in the microelectronics sector. His innovative patents and collaborative efforts underscore his impact on the industry, particularly through his work at Adeia Semiconductor Bonding Technologies Inc. With a continued focus on electrical interconnects and transmission lines, he is likely to remain a key figure in driving future innovations in microelectronic assembly.