This inventor holds 1 USPTO granted patent. Top assignee: Headway Technologies, Incorporated. Active years: 2014.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2014
Title: Jaswant Chudasama: Innovator in Electroplating Technology
Introduction
Jaswant Chudasama is a notable inventor based in Milpitas, CA (US). He has made significant contributions to the field of electroplating, particularly in methods that enhance the efficiency and effectiveness of metal deposition processes. His innovative approach has led to the development of a unique paddle assembly that addresses challenges faced during chemical mechanical polishing.
Latest Patents
Jaswant holds a patent for a method titled "Paddle for electroplating for selectively depositing greater thickness." This electroplating method selectively deposits a greater thickness of a metal or alloy layer on regions of a wafer that experience higher thickness loss during subsequent polishing processes. The paddle assembly features three rectangular sides that form a triangular shape from an end view, with a notch on the bottom side that faces the wafer during plating. This design allows for precise alignment and selective thickness increase in specific areas of the wafer.
Career Highlights
Jaswant Chudasama is currently employed at Headway Technologies, Incorporated, where he continues to innovate in the field of electroplating. His work has been instrumental in advancing technologies that improve manufacturing processes in the semiconductor industry. With a focus on practical solutions, he has contributed to the development of methods that enhance product quality and efficiency.
Collaborations
Throughout his career, Jaswant has collaborated with talented individuals such as Chen-Li Lin and Chao-Peng Chen. These collaborations have fostered an environment of innovation and have led to the successful development of new technologies in the electroplating domain.
Conclusion
Jaswant Chudasama's contributions to electroplating technology exemplify the impact of innovative thinking in the semiconductor industry. His patent and ongoing work at Headway Technologies highlight his commitment to advancing manufacturing processes.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile