The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Dec. 30, 2014
Filed:
Jun. 18, 2012
Chao-peng Chen, Fremont, CA (US);
Jaswant Chudasama, Milpitas, CA (US);
Pradeep Mishra, San Jose, CA (US);
Chen-li Lin, Fremont, CA (US);
David Wagner, San Jose, CA (US);
Chao-Peng Chen, Fremont, CA (US);
Jaswant Chudasama, Milpitas, CA (US);
Pradeep Mishra, San Jose, CA (US);
Chen-Li Lin, Fremont, CA (US);
David Wagner, San Jose, CA (US);
Headway Technologies, Inc., Milpitas, CA (US);
Abstract
An electroplating method is disclosed that selectively deposits a greater thickness of a metal or alloy layer on a region of wafer that has a higher thickness loss during a subsequent chemical mechanical polish process. A paddle assembly has three rectangular sides joined at their edges to form a triangle shape from an end view, and a notch in a bottom side that faces a wafer during the plating process. The notch extends along second and third paddle sides to a height up to about 50% of the paddle thickness. The thickness in a K-block region that has two sides formed parallel to the wafer flat is selectively increased by aligning a first side of the paddle notch side directly over one K-block side and aligning a second notch side directly over a second K-block side during a paddle movement cycle. The notch may be rectangular shaped or tapered.