This inventor holds 1 USPTO granted patent. Top assignee: Union Semiconductor Technology Corporation. Active years: 2005.
Company Filing History:
Years Active: 2005
Title: Jason Christopherson: Innovator in Metal Layer Processing
Introduction
Jason Christopherson is a notable inventor based in Chippewa Falls, WI (US). He has made significant contributions to the field of semiconductor technology, particularly in the processing of metal layers. His innovative approach has led to the development of a unique patent that enhances the efficiency of metal layer applications.
Latest Patents
Jason holds a patent for a process to pattern thick TiW metal layers using uniform and selective etching. This method involves processing a thick TiW metal layer on a dielectric layer, which is deposited on a substrate, such as silicon. The process begins with the deposition of the TiW metal layer onto the dielectric layer, followed by the application of a photoresist. The method effectively removes nearly all of the TiW metal layer not in contact with the photoresist through a uniform etch, achieving a removal rate of 80% to 90%. Subsequently, the TiW metal layer is selectively etched to the dielectric layer, allowing for a faster removal rate of the TiW metal layer compared to the dielectric layer, specifically at a rate of 2.7 times faster.
Career Highlights
Jason Christopherson is currently employed at Union Semiconductor Technology Corporation, where he continues to innovate in the semiconductor field. His work has been instrumental in advancing the techniques used in metal layer processing, contributing to the overall efficiency and effectiveness of semiconductor manufacturing.
Collaborations
Jason collaborates with talented professionals in his field, including Hans Peter Mikelson and Michael Paul Fleischer. Their combined expertise fosters a creative environment that drives innovation and enhances the development of new technologies.
Conclusion
In summary, Jason Christopherson is a distinguished inventor whose work in metal layer processing has made a significant impact in the semiconductor industry. His patent for the process to pattern thick TiW metal layers showcases his innovative spirit and dedication to advancing technology.