Taipei, Taiwan

Jason Chien


Average Co-Inventor Count = 4.0

ph-index = 1


Location History:

  • Taipei, TW (2020 - 2022)
  • New Taipei, TW (2021 - 2022)

Company Filing History:


Years Active: 2020-2022

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4 patents (USPTO):

Title: Innovator Spotlight: Jason Chien

Introduction

Jason Chien is an accomplished inventor based in Taipei, Taiwan, known for his significant contributions to the field of semiconductor packaging. With four patents to his name, Chien has played a vital role in advancing technology that underpins many electronic devices in use today.

Latest Patents

Among his most recent patents, Jason has developed a semiconductor package that features an innovative configuration of leads. This package includes a first lead with both ends extending in the same direction. A second lead, partially enclosed by the first lead, facilitates the efficient connection to a die pad, where a die is mounted. Wires serve to electrically connect the die to both the first and second leads, all covered under an insulating layer that ensures optimum functionality. His commitment to improving integrated circuit packaging is also evident in another recent patent. This patent outlines a method for packaging integrated circuits, involving the connection of input/output pads of a first die to terminals of a lead frame using palladium-coated copper wires, followed by encapsulation in a mold compound.

Career Highlights

Jason Chien has made significant strides in his career at Texas Instruments, a leading company in semiconductor technology. His inventive work has not only resulted in patents but also has contributed to the ongoing innovations that Texas Instruments is recognized for in the electronics industry.

Collaborations

Throughout his career, Chien has collaborated with other talented individuals in the field. Noteworthy coworkers such as Honglin Guo and Byron Lovell Williams have worked alongside him to foster innovation and push the boundaries of semiconductor technology.

Conclusion

In conclusion, Jason Chien exemplifies the spirit of innovation through his patents and contributions to semiconductor packaging. As he continues to develop groundbreaking technologies at Texas Instruments, his work is sure to have a lasting impact on the industry and inspire future inventors.

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