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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10629562 B1

PDFFull Text
Date of Patent:
Apr. 21, 2020

Filed:

Jul. 02, 2018

Integrated circuit packaging

Applicant:

Texas Instruments Incorporated, Dallas, TX (US);

Inventors:

Honglin Guo, Dallas, TX (US);

Jason Chien, Taipei, TW;

Byron Lovell Williams, Plano, TX (US);

Jeffrey Alan West, Dallas, TX (US);

Anderson Li, New Taipei, TW;

Arvin Nono Verdeflor, Allen, TX (US);

Assignee:

TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);

Attorneys:

Dawn Jos

Charles A. Brill

Frank D. Cimino

Primary Examiner:

Thinh T Nguyen

Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 21/56 (2006.01); H01L 25/00 (2006.01); H01L 23/495 (2006.01); H01L 23/31 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 24/49 (2013.01); H01L 21/56 (2013.01); H01L 21/565 (2013.01); H01L 23/3121 (2013.01); H01L 23/3142 (2013.01); H01L 23/4952 (2013.01); H01L 23/49575 (2013.01); H01L 24/85 (2013.01); H01L 25/0655 (2013.01); H01L 25/50 (2013.01); H01L 23/3107 (2013.01); H01L 23/49503 (2013.01); H01L 24/45 (2013.01); H01L 24/48 (2013.01); H01L 2224/45144 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/45565 (2013.01); H01L 2224/45664 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48247 (2013.01); H01L 2224/49171 (2013.01); H01L 2224/49175 (2013.01); H01L 2224/49505 (2013.01); H01L 2224/85013 (2013.01); H01L 2224/85913 (2013.01); H01L 2224/85986 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/1205 (2013.01); H01L 2924/181 (2013.01);
Abstract

An integrated circuit package and methods for packaging an integrated circuit. In one example, a method for packaging an integrated circuit includes connecting input/output pads of a first die to terminals of a lead frame via palladium coated copper wires. An oxygen plasma is applied to the first die and the palladium coated copper wires. The first die and the palladium coated copper wires are encapsulated in a mold compound after application of the oxygen plasma.

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