Taipei, Taiwan

Anderson Li


Average Co-Inventor Count = 6.0

ph-index = 1


Company Filing History:


Years Active: 2020-2022

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2 patents (USPTO):

Title: The Innovations of Inventor Anderson Li in Integrated Circuit Packaging

Introduction

Anderson Li is an accomplished inventor based in New Taipei, Taiwan. With a total of two patents to his name, he has made significant contributions to the field of integrated circuit packaging. His innovative methods and techniques are paving the way for advancements in electronic device manufacturing.

Latest Patents

Anderson Li’s latest patents focus on improving the methods for packaging integrated circuits. The first patent describes a process that connects input/output pads of a first integrated circuit die to terminals of a lead frame using palladium-coated copper wires. In this method, an oxygen plasma is applied to both the first integrated circuit die and the copper wires. After this process, the components are encapsulated in a mold compound, enhancing durability and performance.

The second patent covers a similar innovative approach, where an integrated circuit package is created with the same core techniques involving palladium-coated copper wires and oxygen plasma application. This method streamlines the packaging process and improves the efficiency of integrated circuit manufacturing.

Career Highlights

Anderson Li is currently employed at Texas Instruments Corporation, a leading company known for its technological innovations. His work at Texas Instruments reflects a commitment to advancing the electronics industry through practical and effective solutions.

Collaborations

In his professional journey, Anderson collaborates with notable peers, including Honglin Guo and Jason Chien. Together, they contribute to developing pioneering technologies that address the challenges in integrated circuit packaging and related fields.

Conclusion

Anderson Li's contributions to integrated circuit packaging highlight his role as a significant inventor in the electronics sector. With a focus on innovative packaging methods, his patents are not only crucial for Texas Instruments Corporation but also for the future of electronic devices, exemplifying how collaboration and creativity can drive technological progress.

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