Texas Instruments Corporation

Anderson Li

Jeffrey Alan West

Byron Lovell Williams

Honglin Guo

Jason Chien

Arvin Nono Verdeflor

An integrated circuit and methods for packaging the integrated circuit. In one example, a method for packaging an integrated circuit includes connecting input/output pads of a first integrated circuit die to terminals of a lead frame via palladium coated copper wires. An oxygen plasma is applied to the first integrated circuit die and the palladium coated copper wires. The first integrated circuit die and the palladium coated copper wires are encapsulated in a mold compound after application of the oxygen plasma.

Integrated circuit packaging

An integrated circuit package and methods for packaging an integrated circuit. In one example, a method for packaging an integrated circuit includes connecting input/output pads of a first die to terminals of a lead frame via palladium coated copper wires. An oxygen plasma is applied to the first die and the palladium coated copper wires. The first die and the palladium coated copper wires are encapsulated in a mold compound after application of the oxygen plasma.

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Taipei, Taiwan

Anderson Li