The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 03, 2021
Filed:
Oct. 14, 2019
Texas Instruments Incorporated, Dallas, TX (US);
TEXAS INSTRUMENTS INCORPORATED, Dallas, TX (US);
Abstract
A packaged semiconductor device includes a leadframe including a finger pad(s) that is integrated, and spans a finger pad area including a width narrower than its length. A first portion of the finger pad area provides a die support area. A second portion of the finger pad area provides a wire bond area including first and second wire bond pads on a first and second side of the die support area. One of the wire bond pads further includes a lead terminal integrally connected. The IC die has a top side with bond pads and a back side having a non-electrically conductive die attach material attached to the die support area. Bond wires extend from the bond pads to the first and second wire bond pads. A mold compound encapsulates the packaged semiconductor device leaving exposed at least the lead terminal on a bottom side of the packaged semiconductor device.