Seven Fields, PA, United States of America

Jason Allen Brehm

This inventor holds 1 USPTO granted patent. Top assignee: Thermal Corporation. Active years: 2002.


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 14(Granted Patents)


Company Filing History:


Years Active: 2002

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1 patent (USPTO):Explore Patents

Title: Jason Allen Brehm: Innovator in Heat Sink Technology

Introduction

Jason Allen Brehm is a notable inventor based in Seven Fields, PA (US). He has made significant contributions to the field of thermal management through his innovative designs. His work primarily focuses on enhancing the efficiency of heat dissipation systems.

Latest Patents

Brehm holds a patent for a "Heat sink assembly with over-molded cooling fins." This invention features a heat sink assembly that utilizes high conductivity plastic, formed through an injection molding process. The design integrates both the heat pipe and cooling fins into the base, creating an efficient thermal management solution. The cooling fins are embedded in the top surface of the heat sink base, and a cooling fan can be mounted to enhance air circulation. This innovative design significantly reduces thermal resistance, improving the overall performance of the heat sink.

Career Highlights

Brehm is currently employed at Thermal Corporation, where he continues to develop advanced thermal management solutions. His expertise in heat sink technology has positioned him as a valuable asset to the company. With a focus on practical applications, he strives to improve the efficiency of electronic cooling systems.

Collaborations

Brehm has collaborated with notable colleagues, including Robert E. DeHoff and Kevin A. Grubb. Their combined efforts contribute to the innovative projects at Thermal Corporation, fostering a collaborative environment that encourages creativity and technical advancement.

Conclusion

Jason Allen Brehm is a distinguished inventor whose work in heat sink technology has made a significant impact on thermal management solutions. His innovative designs and collaborations continue to push the boundaries of efficiency in electronic cooling systems.

Profile summary based on public USPTO records.
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