The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jun. 25, 2002

Filed:

Aug. 16, 2000
Applicant:
Inventors:

Robert E. DeHoff, Mt. Joy, PA (US);

Jason Allen Brehm, Seven Fields, PA (US);

Kevin A. Grubb, Groton, CT (US);

Assignee:

Thermal Corp., Stanton, DE (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 ;
U.S. Cl.
CPC ...
H05K 7/20 ;
Abstract

A heat sink assembly having a base formed through an injection molding process utilizing high conductivity plastic in which both the heat pipe and the cooling fins are over-molded into the base to form an integral assembly. The heat pipe is of known construction that operates to transfer heat from a source to a remote location for dissipation. The cooling fins are preferably of the folded fin array configuration and are embedded into the top surface of the heat sink base. A cooling fan can be mounted to the assembly to draw air across the folded fin array for dissipation of the heat conducted efficiently from the heat pipe into the heat sink, including the folded fin array. The thermal resistance of the heat sink is improved as the interface resistance and the spreading resistance between the heat pipe and the cooling fins are substantially reduced.


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