Company Filing History:
Years Active: 2012
Title: The Innovations of Jar-Dar Yang
Introduction
Jar-Dar Yang is a prominent inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 3 patents. His work focuses on enhancing the efficiency and functionality of multi-chip stack package structures.
Latest Patents
One of Jar-Dar Yang's latest patents is a multi-chip stack package structure. This innovative design comprises a substrate with a defined chip placement area on its upper surface and multiple contacts located outside this area. The structure includes a first chip placed in the chip placement area, featuring a rear surface and a number of first pads on its active surface. Each of these pads has a first bump formed on it. Metal wires connect these first bumps to the contacts. Additionally, a second chip with its own set of second pads and bumps is mounted on the first chip, allowing for efficient connectivity between the two chips.
Career Highlights
Jar-Dar Yang is currently employed at Chipmos Technologies Inc., a company known for its advanced semiconductor packaging solutions. His work at Chipmos has allowed him to develop and refine his innovative ideas, contributing to the company's reputation in the industry.
Collaborations
Throughout his career, Jar-Dar Yang has collaborated with notable colleagues, including David Wei Wang and An-Hong Liu. These partnerships have fostered a creative environment that encourages the development of cutting-edge technologies.
Conclusion
Jar-Dar Yang's contributions to the field of semiconductor packaging through his innovative patents and collaborations highlight his importance as an inventor. His work continues to influence advancements in technology and improve the efficiency of multi-chip stack package structures.