Company Filing History:
Years Active: 1987-2011
Title: Janos Legrady: Innovator in Surface Mount Technology
Introduction
Janos Legrady is a prominent inventor based in Putnam Valley, NY (US). He has made significant contributions to the field of surface mount technology, holding a total of 18 patents. His innovative designs and methods have advanced the way electronic components are secured and connected on printed circuit boards.
Latest Patents
Among his latest patents is the "Surface mount (SMT) crimp terminal and method of securing wire to same." This invention features a seamless circular tube or cylinder designed for mounting on printed circuit boards. The method involves depositing the SMT crimp terminal on a copper pad coated with solder paste, allowing for effective soldering through heat application. The design ensures that a bare wire can be securely retained within the tube, providing a retention force that exceeds the wire's breaking strength.
Another notable patent is the "Surface mount crimp terminal and method of crimping an insulated conductor therein." This invention utilizes a flat deformable conductive member to create a U-shaped cross-section for a wire-receiving channel. The design includes piercing spikes and ribs that enhance the electrical and mechanical properties of the termination once crimped.
Career Highlights
Janos Legrady has dedicated his career to advancing surface mount technology. His work at Zierick Manufacturing Corporation has positioned him as a key player in the industry. His innovative patents reflect his commitment to improving electronic component assembly and reliability.
Collaborations
Throughout his career, Janos has collaborated with talented individuals such as Ronald M. Fredriks and Raffaele Tarulli. These partnerships have contributed to the development of cutting-edge technologies in the field.
Conclusion
Janos Legrady's contributions to surface mount technology have significantly impacted the electronics industry. His innovative patents and dedication to his work continue to inspire advancements in electronic component assembly.