The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 07, 2011
Filed:
Mar. 15, 2010
Janos Legrady, Putnam Valley, NY (US);
Raffaele Tarulli, Irvington, NY (US);
Janos Legrady, Putnam Valley, NY (US);
Raffaele Tarulli, Irvington, NY (US);
Zierick Manufacturing Corporation, Mount Kisco, NY (US);
Abstract
An surface mount technology ('SMT') crimp terminal for mounting on printed circuit boards is in the form of a seamless circular tube or cylinder. The method of use includes depositing the SMT crimp terminal on a copper pad or land on a printed circuit board ('PCB') coated with solder paste to render the pad or land tacky. The solder is reflowed by application of heat and the crimp terminal is soldered to the PCB. A bare wire to be retained is inserted through one end of the tube and the tube is subjected to sufficiently high stress, intermediate its axial ends, to induce plastic flow on the surface of the material. The force plastically deforms the central region of the tube as well as the bare wire received therein. Any form of mechanical hydraulic press can be used for this purpose and resulting deformation of the crimp terminal and the wire contained therein provides a retention force on the wire which is greater than wire breaking strength.