Company Filing History:
Years Active: 2013-2015
Title: Jan Van Kempen: Innovator in Semiconductor Technology
Introduction
Jan Van Kempen is a notable inventor based in Cuyk, Netherlands. He has made significant contributions to the field of semiconductor technology, holding a total of 3 patents. His work focuses on innovative methods and devices that enhance the efficiency and functionality of semiconductor components.
Latest Patents
One of Jan's latest patents is for a pre-soldered leadless package. This invention describes a semiconductor device that includes a patterned conductive layer defining contact pads for connection to terminals of a semiconductor chip. The semiconductor chip is mounted with an adhesive layer on the conductive layer, allowing for wire bonding to connect the chip's terminals to the contact pads. The molding compound covers the chip, wire bonds, and contact pads, ensuring a compact and efficient design. Another aspect of this invention involves a method of manufacturing a semiconductor device, which includes several steps such as providing a substrate carrier, etching, and mounting the semiconductor chip. This method enables a reduced minimum bondpad pitch and features a by-design-wettable terminal side for improved automated board inspection.
Career Highlights
Jan Van Kempen is currently employed at NXP B.V., a leading company in semiconductor solutions. His work at NXP has allowed him to develop and patent innovative technologies that contribute to the advancement of the industry. His expertise in semiconductor devices has positioned him as a key player in the field.
Collaborations
Jan has collaborated with several talented individuals, including René Wilhelmus Johannes Maria Van Den Boomen and Emiel De Bruin. These collaborations have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.
Conclusion
Jan Van Kempen is a distinguished inventor whose work in semiconductor technology has led to multiple patents and significant advancements in the field. His contributions continue to shape the future of semiconductor devices and manufacturing processes.