Nxp B.v.

Jan Van Kempen

Emiel De Bruin

René Wilhelmus Johannes Maria Van Den Boomen

Rene Wilhelmus Johannes Maria Van Den Boomen

Consistent with an example embodiment, a semiconductor device comprises a patterned conductive layer defining contact pads for being connected to terminals of a semiconductor chip. The semiconductor chip comprises the terminals at a first side and an adhesive layer at a second side opposite to the first side; wherein, the semiconductor chip is mounted with an adhesive layer on a patterned conductive layer such that the semiconductor chip part of each respective contact pad leaves part thereof uncovered by the chip for wire bonding. Wire bonds connect respective terminals of the semiconductor chip and respective contact pads at the first side thereof. A molding compound covers the semiconductor chip, the wire bonds and the contact pads; wherein, the molding compound is also located on the second side of the semiconductor device, separating the contact regions that are located directly on a backside of the contact pads.

Pre-soldered leadless package

The invention relates to a method of manufacturing a semiconductor device, the method comprising: i) providing a substrate carrier comprising a substrate layer and a patterned conductive layer, wherein the patterned conductive layer defines contact pads; ii) partially etching the substrate carrier using the patterned conductive layer as a mask defining contact regions in the substrate layer; iii) providing the semiconductor chip; iv) mounting said semiconductor chip with the adhesive layer on the patterned conductive layer such that the semiconductor chip covers at least one of the trenches and part of the contact pads neighboring the respective trench are left uncovered for future wire bonding; v) providing wire bonds between respective terminals of the semiconductor chip and respective contact pads of the substrate carrier; vi) providing a molding compound covering the substrate carrier and the semiconductor chip, and vii) etching the backside (S) of the substrate carrier to expose the molding compound in the trenches. The invention further relates to a semiconductor device manufactured with such method, and to a printed-circuit board comprising such semiconductor device. The invention enables a reduced minimum bondpad pitch. An embodiment of the invention has a by-design-wettable terminal side at the perimeter of the device. This latest mentioned feature enables automated board inspection w.r.t. board mounting quality.

The invention relates to semiconductor devices and methods of manufacturing. In certain embodiments, a semiconductor device can include: a) a contact pad with pre-shaped sidewalls; b) a semiconductor chip having a terminal that is electrically connected to the contact pad, and c) a protective compound covering the semiconductor chip and at least part of the sidewalls. The sidewall can be rough or the sidewall can be tapered to facilitate locking of the contact pad into the compound.

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Cuyk, Netherlands

Jan Van Kempen