Jan I Strandberg

Title: Innovations by Jan I Strandberg

Introduction

Jan I Strandberg is a notable inventor based in Cupertino, CA (US). He has made significant contributions to the field of electrical engineering, particularly in the development of printed wiring boards and thermal management solutions. With a total of 7 patents to his name, Strandberg's work has had a considerable impact on the industry.

Latest Patents

One of his latest patents is titled "Printed wiring board with controlled line impedance." This invention addresses the challenge of controlling the inter-layer impedance of a deposited thin film layer stack that accommodates high-density interconnects. The solution allows high-density signal lines to be routed over a reference plane to achieve a desired characteristic impedance. In this embodiment, a first thin-film metal layer is formed on a planarized layer made from multiple thin film dielectric layers. The reduced pad footprint in the first thin-film metal layer enables a significant portion of it to serve as a reference or ground plane for signal lines formed in a second thin-film metal layer, which is separated from the first by a thin dielectric layer.

Another significant patent is "Isolated flip chip of BGA to minimize interconnect stress due to thermal mismatch." This invention presents a wiring substrate designed to reduce thermal expansion stress. The substrate, which can be a laminated PWB, thin film circuit, lead frame, or chip carrier, accepts an integrated circuit such as a die, flip chip, or ball grid array package. The wiring substrate features a thermal expansion stress reduction insert or void in a thermal expansion stress region near the integrated circuit. This design improves the flexibility of the wiring substrate in the area joined to the integrated circuit, thereby reducing thermal stress between the components.

Career Highlights

Jan I Strandberg is currently employed at Kulicke & Soffa Holdings, Inc., where he continues to innovate and develop advanced technologies. His work has been instrumental in enhancing the performance and reliability of electronic components.

Collaborations

Throughout his career, Strandberg has collaborated with several talented individuals, including David J Chazan and James L Lykins. These partnerships have contributed to the successful development of his patented technologies.

Conclusion

Jan I Strandberg's contributions to the field of electrical engineering through his innovative patents demonstrate his expertise and commitment to advancing technology. His work continues to influence the industry and pave the way for future innovations.