The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 01, 2003
Filed:
Feb. 23, 2000
Jan I. Strandberg, Palo Alto, CA (US);
Kulicke & Soffa Holdings, Inc., Willow Grove, PA (US);
Abstract
The present invention provides a solution to the problem of controlling the inter-layer impedance of a deposited thin film layer stack accommodating high-density interconnects. The invention enables high-density signal lines to be routed over a reference plane to achieve a desired characteristic impedance. In one embodiment, a first thin-film metal layer is formed on a planarized layer fabricated from multiple thin film dielectric layers. The reduced pad footprint in the first thin-film metal layer allows a major portion of the first thin-film metal layer to serve as a reference, or ground, plane to signal lines formed in a second thin-film metal layer that is separated from the first thin-film metal layer by a thin dielectric layer.