Rijssen, Netherlands

Jan Hendrik Berkel

This inventor holds 3 USPTO granted patents and 1 published patent application and 1 EPO patent. Top assignees: Schoeller Electronics Systems Gmbh, Schoeller-Electronics Gmbh, Other. Active years: 2014-2021.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Jan Hendrik Berkel. Retrieved from https://idiyas.com/inventor/jan-hendrik-berkel

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 3 

% Patents Active = 33.3

 

Average Co-Inventor Count = 1.2

ph-index = 2

Forward Citations = 8(Granted Patents)


Company Filing History:


Years Active: 2014-2021

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3 patents (USPTO):Explore Patents

Title: Jan Hendrik Berkel: Innovator in Circuit Board Technology

Introduction

Jan Hendrik Berkel is a notable inventor based in Rijssen, Netherlands. He has made significant contributions to the field of circuit board technology, holding a total of 3 patents. His innovative designs focus on enhancing the functionality and efficiency of electronic components.

Latest Patents

One of Jan's latest patents is titled "PCB for bare die mount and process therefore." This invention provides embodiments for a circuit board that comprises a plurality of electrically conductive layers and a plurality of electrically non-conductive layers arranged in a laminated stack. The laminated stack defines a front face and a back face, with a thermal conductive heat body extending from a die bond pad on the front face to an electrically conductive layer on the back face. The die bond pad is specifically designed for a bare die to be mounted thereon. Additionally, a bonding agent is used to adhere the thermal conductive heat body to the walls of an opening in the laminated stack, ensuring a monolithic structure. Furthermore, a plurality of wire bond pads on the front face adjacent to the die bond pad are equipped with a surface finish material that is suitable for wire bonding.

Another significant invention relates to a circuit board designed for populating with at least one electronic component. This circuit board features at least one heat conducting element connected to a surface of a sheet-like circuit board body through a boundary layer. The boundary layer consists of both electrically non-conducting and electrically conducting layers, which work together to create a receiving space with a pocket-like volume for the conducting layer.

Career Highlights

Throughout his career, Jan Hendrik Berkel has worked with various companies, including Schoeller Electronics Systems GmbH. His experience in the industry has allowed him to develop innovative solutions that address the challenges faced in electronic component design.

Collaborations

Jan has collaborated with notable professionals in the field, including his coworker Todd C. Robinson. These partnerships have contributed to the advancement of technology in circuit board design.

Conclusion

Jan Hendrik Berkel is a distinguished inventor whose work in circuit board technology has led to several innovative patents. His contributions continue to influence the industry and pave the way for future advancements.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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