The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 14, 2014
Filed:
Aug. 30, 2012
Applicant:
Jan Hendrik Berkel, Rijssen, NL;
Inventor:
Jan Hendrik Berkel, Rijssen, NL;
Assignee:
Schoeller-Electronics GmbH, Wetter/Hessen, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); F28F 21/00 (2006.01); H05K 3/30 (2006.01); H01L 23/367 (2006.01); H01L 23/36 (2006.01); H05K 3/00 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H05K 1/0201 (2013.01); H01L 23/3677 (2013.01); H05K 1/0204 (2013.01); H05K 2201/09745 (2013.01); H01L 2224/73265 (2013.01); H05K 3/30 (2013.01); H05K 2201/068 (2013.01); H01L 24/73 (2013.01); H05K 2201/1059 (2013.01); H05K 2201/10416 (2013.01); H01L 2224/48472 (2013.01); H01L 2224/32245 (2013.01); F28F 21/00 (2013.01); H01L 24/32 (2013.01); H01L 23/36 (2013.01); H01L 24/29 (2013.01); H01L 2224/2919 (2013.01); H01L 25/0655 (2013.01); H01L 2224/48227 (2013.01); H01L 24/48 (2013.01); H05K 3/0061 (2013.01); H05K 1/021 (2013.01);
Abstract
Disclosed herein is a method for assembling a circuit board which has at least one layer copper clad on one or both sides or provided with conductor tracks, wherein, in one assembly step, at least one rigid flange insert is inserted into an associated recess in the circuit board or into a component associated with the circuit board and wherein at least one semiconductor die of a semiconductor component is applied onto the inserted flange insert in a subsequent application step.
Berkel, Jan. (2014). Method for assembling a circuit board (U.S. Patent No. 8859907). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/8859907
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile