This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: National Semiconductor Corporation. Active years: 2007.
Company Filing History:
Years Active: 2007
Title: Jamie A Bayan: Innovator in Micro-Array Integrated Circuit Packaging
Introduction
Jamie A Bayan is a notable inventor based in Palo Alto, California. She has made significant contributions to the field of integrated circuit packaging, particularly through her innovative patent related to wire bonding techniques.
Latest Patents
Jamie holds a patent titled "Wire bonding on thinned portions of a lead-frame configured for use in a micro-array integrated circuit package." This invention focuses on wire bonding on thinned portions of a lead-frame designed for integrated circuit packages. The patent outlines the use of a harder lead-frame material, improved adhesive tape, and various structural features of the lead-frame itself. These elements work together to facilitate the attachment of wire bonds to thinned areas of the lead-frame, eliminating the need for supports placed directly under the bond sites. This advancement helps in removing unwanted conductive areas on the outer surface of an integrated circuit package.
Career Highlights
Jamie A Bayan is currently employed at National Semiconductor Corporation, where she continues to innovate in the field of semiconductor technology. Her work has been instrumental in enhancing the efficiency and reliability of micro-array integrated circuits.
Collaborations
Some of her notable coworkers include Ashok S Prabhu and Chan Peng Yeen, who have collaborated with her on various projects within the company.
Conclusion
Jamie A Bayan's contributions to the field of integrated circuit packaging through her innovative patent demonstrate her expertise and commitment to advancing technology. Her work continues to influence the semiconductor industry positively.