The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 21, 2007
Filed:
Jun. 18, 2004
Jamie A. Bayan, Palo Alto, CA (US);
Ashok S. Prabhu, San Jose, CA (US);
Chan Peng Yeen, Melaka, MY;
Hasfiza Ramley, Cheras, MY;
Santhiran S/o Nadarajah, Melaka, MY;
Jamie A. Bayan, Palo Alto, CA (US);
Ashok S. Prabhu, San Jose, CA (US);
Chan Peng Yeen, Melaka, MY;
Hasfiza Ramley, Cheras, MY;
Santhiran S/O Nadarajah, Melaka, MY;
National Semiconductor Corporation, Santa Clara, CA (US);
Abstract
Aspects of the invention recite wire bonding on thinned portions of a lead-frame that is configured for use in an IC package. A harder lead-frame material, improved adhesive tape, and various structural features of the lead-frame itself, in various combinations or subcombinations, facilitate the attachment of wire bonds to thinned areas of the lead-frame. This eliminates the need for supports placed directly under the bond sites, removing unwanted conductive areas on the outer surface of an IC package.