This inventor holds 1 USPTO granted patent. Top assignee: Satcon Technology Corporation. Active years: 2010.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2010
Title: James William Connell, III: Innovator in Electronic Semiconductor Packaging
Introduction
James William Connell, III is a notable inventor based in Upton, MA (US). He has made significant contributions to the field of electronic semiconductor packaging. His innovative designs have paved the way for advancements in heat removal technologies.
Latest Patents
Connell holds a patent for a double-sided package for power modules. This electronic semiconductor package is designed to accommodate wide band gap electronic semiconductor devices that require efficient heat removal. The package features a first thermally-conductive, electrically-insulative substrate with a predetermined electrically-conductive wire pattern on one side of the semiconductor device. On the opposite side, a second thermally-conductive, electrically-insulative substrate is present. A heat removal device, made from a graphite-metal or metal-matrix composite material, is mechanically coupled to the second substrate. The design ensures that the coefficients of thermal expansion of the heat removal device and the substrates are matched to minimize internal and external stresses. Connell's patent is a testament to his innovative approach in addressing thermal management challenges in electronic devices.
Career Highlights
James William Connell, III is associated with Satcon Technology Corporation, where he has contributed to various projects related to semiconductor technology. His work has been instrumental in enhancing the performance and reliability of electronic components.
Collaborations
Connell has collaborated with notable colleagues, including Leo Francis Casey and Bogdan Szczepan Borowy. These partnerships have fostered a creative environment that encourages innovation and the development of cutting-edge technologies.
Conclusion
James William Connell, III is a distinguished inventor whose work in electronic semiconductor packaging has made a significant impact in the industry. His innovative designs and collaborations continue to inspire advancements in technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile