The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 31, 2010
Filed:
Aug. 02, 2006
Leo Francis Casey, Lexington, MA (US);
Bogdan Szczepan Borowy, Billerica, MA (US);
Gregg Herbert Davis, Harvard, MA (US);
James William Connell, Iii, Upton, MA (US);
Leo Francis Casey, Lexington, MA (US);
Bogdan Szczepan Borowy, Billerica, MA (US);
Gregg Herbert Davis, Harvard, MA (US);
James William Connell, III, Upton, MA (US);
Satcon Technology Corporation, Boston, MA (US);
Abstract
An electronic semiconductor package is described. The package has a wide band gap electronic semiconductor device requiring heat removal. On one side of the electronic semiconductor device is a first, thermally-conductive, electrically-insulative substrate having a predetermined electrically-conductive wire pattern affixed thereto. On the other side of the electronic semiconductor device is a second, thermally-conductive, electrically-insulative substrate. A heat removal device is mechanically-coupled to the second substrate. The heat removal device is made of a graphite-metal or metal-matrix composite material and a fin array structure of the same material. The coefficients of thermal expansion of the heat removal device and the first and second substrates are matched to minimize internal and external stresses.