Bogdan Szczepan Borowy

Title: Bogdan Szczepan Borowy: Power Electronics and Thermal Management Innovations.

Introduction

Bogdan Szczepan Borowy is an inventor based in Billerica, Massachusetts, whose patent work addresses power electronics, semiconductor packaging, and current control. He is associated with Satcon Technology Corporation and holds 2 patents.

Latest Patents

Borowy’s listed patents include “Double-sided package for power module,” which describes a semiconductor package designed to remove heat from a wide-band-gap electronic device. The design places thermally conductive, electrically insulating substrates on both sides of the device and couples a heat-removal component to one substrate. The component uses graphite-metal or metal-matrix composite material, with matched thermal expansion characteristics intended to reduce stress.

His other listed patent, “Sensor-less, low frequency adaptive current limiter and methods for limiting inductive current using the same,” concerns adaptive control of pulse-width-modulation duty cycles. The system estimates a maximum allowable duty cycle for the next interval, helping keep peak inductor current below a specified limit without relying on a current sensor.

Career Highlights

Borowy’s patent portfolio reflects work on two complementary engineering challenges: managing heat in power modules and controlling current in inductive circuits. Both inventions focus on improving the reliability and performance of power-electronic systems.

Collaborations

Borowy is associated with Satcon Technology Corporation. His listed coworkers include Leo Francis Casey and Gregg Herbert Davis.

Conclusion

Bogdan Szczepan Borowy’s patents address thermal management and adaptive current limiting, highlighting his contributions to power-electronics design.