Endicott, NY, United States of America

James W Orband

This inventor holds 2 USPTO granted patents. Top assignee: Endicott Interconnect Technologies, Inc.. Active years: 2007-2008.

IDiyas Innovation Intelligence. (2026). Inventor Profile: James W Orband. Retrieved from https://idiyas.com/inventor/james-w-orband

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 4.0

ph-index = 2

Forward Citations = 16(Granted Patents)


Company Filing History:


Years Active: 2007-2008

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2 patents (USPTO):Explore Patents

Title: **James W. Orband: Innovator in Circuitized Substrate Technology**

Introduction

James W. Orband, based in Endicott, NY, is an accomplished inventor known for his contributions to the development of advanced circuitized substrates. With two patents to his name, Orband's inventions significantly enhance the manufacturing processes used in electronics, reflecting a commitment to innovation and efficiency.

Latest Patents

Orband's latest patents focus on apparatuses for creating circuitized substrates in a continuous manner. The first patent, "Apparatus for making circuitized substrates in a continuous manner," describes a system utilizing a continuous roll format where layers of conductor and dielectric are integrated. This technology not only bonds these layers but also facilitates subsequent processes such as hole formation and segmentation, ultimately enabling the creation of larger multi-layered substrates with conductive thru-holes.

His second patent, "Apparatus and method for making circuitized substrates in a continuous manner," elaborates on the same innovative approaches, detailing the feeding, bonding, and processing mechanisms that lead to highly efficient production methods. The resulting substrates are designed for scalability, allowing them to be bonded with other similar substrates to enhance functionality in electronic applications.

Career Highlights

James W. Orband works at Endicott Interconnect Technologies, Inc., where he has devoted his career to pushing the boundaries of electronic substrate manufacturing. His practical experience and inventive spirit have made a significant impact on the efficiency and capabilities of the company's product offerings.

Collaborations

In his professional journey, Orband has collaborated with notable coworkers, including John M. Lauffer and Voya Rista Markovich. These partnerships reflect a dynamic work environment where innovation thrives through teamwork and shared expertise.

Conclusion

James W. Orband stands out as a prominent figure in the field of electronic manufacturing, with patents that not only enhance production efficiency but also pave the way for future innovations in circuitized substrates. His work at Endicott Interconnect Technologies, Inc. showcases the significant advancements being made in this vital area of technology.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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