Monmouth, NJ, United States of America

James R Demarco

This inventor holds 2 USPTO granted patents. Top assignee: Intel Corporation. Active years: 2003-2004.

IDiyas Innovation Intelligence. (2026). Inventor Profile: James R Demarco. Retrieved from https://idiyas.com/inventor/james-r-demarco-cujfpnqe

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 50.0

Average Co-Inventor Count = 2.0

ph-index = 2

Forward Citations = 5(Granted Patents)


Location History:

  • Howell, NJ (US) (2003)
  • Monmouth, NJ (US) (2004)

Company Filing History:


Years Active: 2003-2004

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2 patents (USPTO):Explore Patents

Title: James R. Demarco: Innovator in Non-Flat Surface Interconnections

Introduction

James R. Demarco is a notable inventor based in Monmouth, NJ (US). He has made significant contributions to the field of surface mounting technology, particularly in the area of non-flat surfaces. With a total of 2 patents, his work has garnered attention for its innovative approach to solving complex engineering challenges.

Latest Patents

Demarco's latest patents focus on the method of making interconnections to a non-flat surface. This technology allows a non-planar surface to be surface mounted to another surface using modified solder balls. In one embodiment, the solder balls are secured to an irregular surface and then scrapped to create a planar contacting surface. A second surface can then be bonded to the first surface, with the solder balls reflowed to establish a reliable surface mount.

Career Highlights

James R. Demarco is currently employed at Intel Corporation, where he continues to develop and refine his innovative ideas. His work at Intel has positioned him as a key player in advancing surface mounting technologies.

Collaborations

Demarco collaborates with Ponnusamy Palanisamy, a fellow innovator, to further enhance their research and development efforts in the field.

Conclusion

James R. Demarco's contributions to the field of non-flat surface interconnections demonstrate his commitment to innovation and engineering excellence. His patents reflect a deep understanding of complex surface mounting challenges, making him a valuable asset in the technology sector.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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