This inventor holds 1 USPTO granted patent. Top assignee: Intel Corporation. Active years: 2009.
Company Filing History:
Years Active: 2009
Title: James Lake - Innovator in Semiconductor Technology
Introduction
James Lake is a prominent inventor based in Gilbert, AZ (US). He has made significant contributions to the field of semiconductor technology, particularly through his innovative patent related to wafer-level solder bumps. His work has implications for the efficiency and performance of semiconductor packages.
Latest Patents
James Lake holds a patent for a semiconductor package that features a support substrate coupled to a first semiconductor die. This first die includes first conductive bumps, while a second semiconductor die contains second conductive bumps. The two dies are interconnected by joints formed from these conductive bumps and a solder material. This invention enhances the reliability and functionality of semiconductor devices. He has 1 patent to his name.
Career Highlights
James Lake is currently employed at Intel Corporation, a leading company in the technology sector. His role at Intel allows him to work on cutting-edge projects that push the boundaries of semiconductor technology. His expertise and innovative mindset have made him a valuable asset to the company.
Collaborations
James collaborates with various professionals in his field, including his coworker Raul Mancera. Their combined efforts contribute to the advancement of semiconductor technologies and innovations.
Conclusion
James Lake is a noteworthy inventor whose work in semiconductor technology has led to significant advancements in the industry. His patent on wafer-level solder bumps exemplifies his commitment to innovation and excellence in his field.