Company Filing History:
Years Active: 2003
Title: Innovations of James L. Cheever in MicroElectroMechanical Systems
Introduction
James L. Cheever is a notable inventor based in Richardson, TX (US). He has made significant contributions to the field of MicroElectroMechanical Systems (MEMS) with a focus on wafer-level interconnection technologies. With a total of 2 patents, his work has advanced the capabilities of MEMS circuitry.
Latest Patents
Cheever's latest patents involve innovative methods for combining RF MEMS circuitry on substrates with varying resistivity. His patents detail a process where a first high resistivity substrate is overlapped with a second low resistivity substrate. This configuration allows for effective interconnection of MEMS circuitry, enhancing the performance and reliability of electronic devices. A dielectric lid is utilized to protect the MEMS circuitry, ensuring that the interconnecting conductors maintain electrical connections through the substrates.
Career Highlights
James L. Cheever is currently employed at Raytheon Company, where he continues to develop cutting-edge technologies in the MEMS domain. His expertise in wafer-level interconnection has positioned him as a key player in advancing electronic systems.
Collaborations
Throughout his career, Cheever has collaborated with esteemed colleagues such as Charles L. Goldsmith and John Charles Ehmke. These partnerships have fostered innovation and contributed to the successful development of his patented technologies.
Conclusion
James L. Cheever's contributions to the field of MicroElectroMechanical Systems through his patents and collaborations highlight his role as a significant inventor. His work continues to influence advancements in electronic circuitry and interconnection technologies.