Raytheon Company

James L Cheever

John Charles Ehmke

Charles L Goldsmith

Billy D Ables

RF MicroElectroMechanical Systems (MEMS) circuitry ( ) on a first high resistivity substrate ( ) is combined with circuitry ( ) on a second low resistivity substrate ( ) by overlapping the first high resistivity substrate ( ) and MEMS circuitry ( ) with the low resistivity substrate ( ) and circuitry ( ) with the MEMS circuitry ( ) facing the second circuitry ( ). A dielectric lid ( ) is placed over the MEMS circuitry ( ) and between the first substrate ( ) and second substrate ( ) with an inert gas in a gap ( ) over the MEMS circuitry ( ). Interconnecting conductors ( ) extend perpendicular and through the high resistivity substrate ( ) and through the dielectric lid ( ) to make electrical connection with the low resistivity substrate ( ).

Wafer level interconnection

RF MicroElectroMechanical Systems (MEMs) circuitry( ) on a first high resistivity substrate ( )is combined with circuitry ( ) onsecond low-resisitivity substrate ( ) by overlapping the first high resisitivity substrate ( )and MEMs circuitry ( ) with the low resisitivity substrate( ) and circuitry ( ) with the MEMs circuitry ( )facing the second circuitry ( ). A dielectric lid ( ) is placed over the MEMs circuitry ( )and between the first substrate ( )and second substrate ( )with an inert gas in a gap ( )over the MEMs circuitry ( ). Interconnecting conductors ( ) extend perpendicular and through the high resistivity substrate ( )and through the dielectric lid ( ) to make electrical connection with the low resisitivity substrate ( ).

Growing community of inventors

Richardson, TX, United States of America

James L Cheever