Frankfield, Ireland

James Francis Rohan


 

Average Co-Inventor Count = 4.0

ph-index = 1


Company Filing History:


Years Active: 2014

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1 patent (USPTO):Explore Patents

Title: James Francis Rohan: Innovator in Thermal Interface Materials

Introduction

James Francis Rohan, based in Frankfield, Ireland, is a noted inventor in the field of materials science, particularly thermal management solutions. He has made significant contributions through his innovative work at University College Cork, focusing on enhancing thermal conductivity in semiconductor applications.

Latest Patents

Rohan holds a patent for a novel thermal interface material (TIM) that comprises a bulk polymer embedded with sub-micron composite material wires made of silver and carbon nanotubes. These nanotubes are strategically aligned in the axial direction, featuring diameters between 9.5 to 10 nm and a length of approximately 0.7 micrometers. His patented material exhibits remarkable thermal conductivity, allowing for efficient heat transfer between semiconductor devices, such as power semiconductor chips, and various thermal management systems.

Career Highlights

Rohan's work is primarily anchored at University College Cork, where he has been instrumental in advancing research on thermal interface materials. His unique approach to integrating carbon nanotubes within a bulk polymer has opened new avenues for efficient heat dissipation in electronic devices, which is critical for their reliability and performance.

Collaborations

In his pursuit of innovation, Rohan collaborates with esteemed colleagues such as Kafil M Razeeb and Saibal Roy. Their collective expertise enhances the research and development process, fostering an environment where cutting-edge technologies can flourish.

Conclusion

James Francis Rohan's contributions to the field of thermal interface materials mark a significant advancement in semiconductor technology. His innovative patents and collaborative spirit at University College Cork place him at the forefront of research that not only improves device performance but also promotes sustainable technological advancements in thermal management.

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