Richardson, TX, United States of America

James F Haefling

This inventor holds 2 USPTO granted patents. Top assignee: Texas Instruments Corporation. Active years: 1987-1990.

IDiyas Innovation Intelligence. (2026). Inventor Profile: James F Haefling. Retrieved from https://idiyas.com/inventor/james-f-haefling

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.4

ph-index = 2

Forward Citations = 24(Granted Patents)


Company Filing History:


Years Active: 1987-1990

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2 patents (USPTO):Explore Patents

Title: Innovations of James F. Haefling

Introduction

James F. Haefling is a notable inventor based in Richardson, Texas. He has made significant contributions to the field of semiconductor technology, holding 2 patents that showcase his innovative spirit and technical expertise.

Latest Patents

One of his latest patents is for an insulated substrate for flip-chip integrated circuit devices. This substrate is designed for mounting a flip-chip on a metallized circuit on its upper surface. The substrate is made of silicon carbide condensed on a graphite or silicon core. The upper surface of the silicon carbide features a layer of insulating material, which can include silicon oxide, silicon nitride, aluminum nitride, boron nitride, organic insulators like polyimide, and diamond. This insulating layer is crucial as it prevents inadvertent shorting of the integrated circuit. The layer can be deposited on the silicon carbide using various processes such as chemical vapor deposition, sputtering, spinning, or roller coating.

Another significant patent by Haefling involves coatings for ceramic bonding capillaries. This bonding apparatus is used for attaching lead wires to a semiconductor surface. It includes a supply spool containing bonding wire that is fed to a capillary made of non-conductive material. An electric arc forms a ball on the tip of the wire, which is then retracted into the capillary. The ball is heated and compressed onto the semiconductor substrate before being stitched over to a second bonding point, typically the interface pin of the semiconductor device. The non-conductive end of the capillary prevents the coating of the capillary tip with molten metal resulting from the arcing of the bonding wire.

Career Highlights

James F. Haefling is currently employed at Texas Instruments Corporation, where he continues to innovate and contribute to advancements in semiconductor technology. His work has had a lasting impact on the industry, particularly in the development of reliable and efficient semiconductor devices.

Collaborations

Throughout his career, Haefling has collaborated with notable colleagues, including Roger J. Stierman and Thomas H. Ramsey. These collaborations have further enriched his work and contributed to the success of various projects.

Conclusion

James F. Haefling's contributions to the field of semiconductor technology through his patents and work at Texas Instruments Corporation highlight his role as a significant inventor. His innovative solutions continue to influence the

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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