The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 08, 1987
Filed:
Dec. 21, 1984
James F Haefling, Richardson, TX (US);
James W Pritchard, Garland, TX (US);
Roger J Stierman, Richardson, TX (US);
Texas Instruments Incorporated, Dallas, TX (US);
Abstract
A bonding apparatus for bonding lead wires to a semiconductor surface includes a supply spool that contains a supply of the bonding wire that is fed to a capillary that is made of a non-conductive material. An electric arc forms a ball on the tip of the arc and the ball is retracted into the capillary. The ball is heated and compressed onto the semiconductor substrate and is then stitched over to a second bonding point which in most applications is the interface pin of the semiconductor device. The capillary has a non-conductive end that prevents coating of the capillary tip with the molten metal that results from the arcing of the bonding wire.