James Denning Smith

Title: The Innovative Contributions of James Denning Smith

Introduction

James Denning Smith is a notable inventor based in Albany, OR (US). He has made significant contributions to the field of micro-electromechanical systems (MEMS) and has been awarded a total of 7 patents throughout his career. His work has had a profound impact on technology and engineering.

Latest Patents

One of Smith's latest patents is for a "Packaged MEMS Device Assembly." This invention includes a MEMS device, a substrate within which the MEMS device is disposed, and a lid over the substrate. The assembly features first cavities within the lid that meet packaging specifications, as well as second cavities that contain materials and corresponding overflow areas to catch any overflow. Additionally, it includes third cavities and channels that connect the MEMS device to these cavities. Another significant patent is for an "Emitter with Dielectric Layer Having Implanted Conducting Centers." This invention consists of a dielectric layer on a conductor, with a thin metal layer above it. The dielectric layer contains conducting centers that facilitate electron passage through quantum tunneling.

Career Highlights

Throughout his career, James Denning Smith has worked with prominent companies, including Hewlett-Packard Development Company, L.P. and Hewlett-Packard Company. His experience in these organizations has contributed to his expertise in the field of MEMS and electronic devices.

Collaborations

Smith has collaborated with notable individuals in his field, including Thomas E. Pettit and Paul J. Benning. These collaborations have likely enriched his work and led to innovative advancements in technology.

Conclusion

James Denning Smith's contributions to the field of inventions, particularly in MEMS technology, showcase his innovative spirit and dedication to engineering. His patents reflect a commitment to advancing technology and improving device functionality.