The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
May. 25, 2010
Filed:
May. 03, 2006
Charles C Haluzak, Corvallis, OR (US);
Jeffrey R Pollard, Corvallis, OR (US);
Kirby Sand, Corvallis, OR (US);
John R Sterner, Corvallis, OR (US);
Henry Kang, Corvallis, OR (US);
Chien-hua Chen, Corvallis, OR (US);
James Denning Smith, Corvallis, OR (US);
Charles C Haluzak, Corvallis, OR (US);
Jeffrey R Pollard, Corvallis, OR (US);
Kirby Sand, Corvallis, OR (US);
John R Sterner, Corvallis, OR (US);
Henry Kang, Corvallis, OR (US);
Chien-Hua Chen, Corvallis, OR (US);
James Denning Smith, Corvallis, OR (US);
Hewlett-Packard Development Company, L.P., Houston, TX (US);
Abstract
A packaged micro-electromechanical systems (MEMS) device assembly includes a MEMS device, a substrate within which the MEMS device is disposed, and a lid disposed over the substrate. The assembly may include one or more first cavities within the lid having a predetermined volume satisfying packaging specifications for the packaged MEMS device assembly. The assembly may include one or more second cavities within the lid and one or more corresponding overflow areas within the lid, where each second cavity contains a material and each corresponding overflow area is adapted to catch overflow of the material. The assembly may include one or more third cavities within the lid and one or more channels within one of the substrate and the lid to fluidically connect the MEMS device to the third cavities.