Hewlett-packard Development Company, L.P.

Hewlett-packard Company

James Denning Smith

Thomas E Pettit

Chien-Hua Chen

Alexander N Govyadinov

Charles Craig Haluzak

Paul J Benning

Jeffrey R Pollard

John R Sterner

Thomas Eugene Novet

Kirby Sand

Henry Kang

A packaged micro-electromechanical systems (MEMS) device assembly includes a MEMS device, a substrate within which the MEMS device is disposed, and a lid disposed over the substrate. The assembly may include one or more first cavities within the lid having a predetermined volume satisfying packaging specifications for the packaged MEMS device assembly. The assembly may include one or more second cavities within the lid and one or more corresponding overflow areas within the lid, where each second cavity contains a material and each corresponding overflow area is adapted to catch overflow of the material. The assembly may include one or more third cavities within the lid and one or more channels within one of the substrate and the lid to fluidically connect the MEMS device to the third cavities.

Packaged MEMS device assembly

An emitter has a dielectric layer formed on a conductor, with a thin metal layer over the dielectric. A plurality of conducting centers is in the dielectric layer to allow electrons to pass through the dielectric from the conductor to the thin metal layer via quantum tunneling.

Emitter with dielectric layer having implanted conducting centers

A tip, connected to a metal chip component, for forming readable changes in a memory storage system is disclosed. The tip includes a conductive layer, an amorphous silicon layer, and a silicide outer layer. The silicide outer layer contains a metal that has an anneal temperature to form the silicide outer layer at a temperature below that which damages the chip component.

Low temperature silicided tip

A method of abrading a portion of a silicon substrate includes fluidizing abrasive particulate material with a first gas within a storage container, combining the gas fluidized abrasive particulate material with a stream of a second gas to provide a stream of the gas fluidized abrasive particulate material, and directing the stream of the gas fluidized abrasive particulate material at the silicon substrate to abrade the portion of the silicon substrate.

Method of abrading silicon substrate

A method of forming an ink fill slot in a silicon substrate of an ink-jet printhead includes fluidizing abrasive particulate material with a first gas within a storage container, combining the gas fluidized abrasive particulate material with a stream of a second gas to provide a stream of the gas fluidized abrasive particulate material, and directing the stream of the gas fluidized abrasive particulate material at the silicon substrate to form the ink fill slot in the silicon substrate.

Method of forming ink fill slot of ink-jet printhead

A method of delivering abrasive particulate material under pressure from a storage container adapted to contain the abrasive particulate material therein includes communicating an inlet valve with an inlet opening of the storage container and supplying a first gas, regulated to a first predetermined pressure, to the inlet valve. The first gas is released through the inlet valve and into the storage container, and a quantity of the abrasive particulate material is discharged through an outlet opening of the storage container to an output junction. In addition a second gas, regulated to a second predetermined pressure, is supplied to the output junction. As such, a pressurized supply of the abrasive particulate material is formed and delivered through the output junction.

Pressurized delivery method for abrasive particulate material

A pressurized delivery system for abrasive particulate material includes a storage container adapted to contain the abrasive particulate material therein, an input pressure line adapted to communicate with a pressurized source, and a fluidizing pressure line communicating with the input pressure line and an inlet opening in the storage container. A back-pressure pressure line communicates with an unoccupied portion of the storage container and an output pressure line. The output pressure line, into which the abrasive particulate material is fed from the storage container, communicates with the input pressure line, the back-pressure pressure line, and an outlet opening of storage container. During operation, pressurized gas is released through the inlet opening and into the storage container such that the abrasive particulate material adjacent the outlet opening is fluidized and maintained flowable so as to achieve consistent flow of the abrasive particulate material through the outlet opening.

Growing community of inventors

Albany, OR, United States of America

James Denning Smith