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For the Inventor, By the Inventor

Springville, IA, United States of America

James D Sampica

This inventor holds 41 USPTO granted patents and 1 published patent application and 5 EPO patents, primarily in Lamination Technology. Top assignees: Rockwell Collins, Inc., Rockwell International Corporation. Active years: 1997-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: James D Sampica. Retrieved from https://idiyas.com/inventor/james-d-sampica

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 41 

% Patents Active = 87.8

 

Average Co-Inventor Count = 3.6

ph-index = 15

Forward Citations = 554(Granted Patents)


Location History:

  • Cedar Rapids, IA (US) (1997 - 2002)
  • Central City, IA (US) (2001 - 2003)
  • Springville, IA (US) (2006 - 2017)
  • Anamosa, IA (US) (2014 - 2022)

Company Filing History:

goldMedal38 out of 3,023 
 
Rockwell Collins, Inc.
 patents
silverMedal3 out of 3,430 
 
Rockwell International Corporation
 patents

Years Active: 1997-2026

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Areas of Expertise:
Lamination
LED Curing
Substrate Lamination
Optical Assembly
Pressure Sensitive Adhesive
Flexible Glass
Touch Panel
Display Technology
OLED Sealing
Dynamic Display Heater
Precision Alignment
Night Vision Imaging
41 patents (USPTO):Explore Patents
1. 12766821 - Compound curve component lamination method and product (2026-10-20),
2. 11249338 - Flexible to rigid integrated laminator (2022-02-15),
3. 11220093 - Clam shell lamination system (2022-01-11),
4. 11198283 - LED curing during vacuum lamination process (2021-12-14),
5. 11097523 - Systems and methods for roll to roll laminations (2021-08-24),
6. 10213999 - Systems and methods for roll to roll laminations (2019-02-26),
7. 10209804 - Emissive Display over resistive touch sensor with force sensing (2019-02-19),
8. 9981460 - Systems and methods for substrate lamination (2018-05-29),
9. 9638944 - Systems and methods for substrate lamination (2017-05-02),
10. 9573327 - Planarization treatment of pressure sensitive adhesive for rigid-to-rigid substrate lamination (2017-02-21),
11. 9238759 - Systems and methods for adherable and removable thin flexible glass (2016-01-19),
12. 8936057 - Substrate lamination system and method (2015-01-20),
13. 8746311 - System and method for completing lamination of rigid-to-rigid substrate by the controlled application of pressure (2014-06-10),
14. 8723809 - Touch panel system and process (2014-05-13),
15. 8691043 - Substrate lamination system and method (2014-04-08),

Title: The Innovative Journey of James D Sampica

Introduction: James D Sampica, a talented inventor hailing from Springville, IA, has made significant contributions to the world of innovation with his creative mind and dedication to problem-solving.

Latest Patents: James D Sampica's latest patents include groundbreaking inventions in the field of sustainable energy solutions and advanced agricultural technologies, showcasing his commitment to creating a more efficient and eco-friendly future.

Career Highlights: With a career spanning over two decades, James D Sampica has established himself as a pioneer in the industry, holding multiple patents that have revolutionized various sectors. His innovative spirit and relentless pursuit of excellence have earned him recognition as a leading figure in the world of inventors.

Collaborations: Throughout his career, James D Sampica has collaborated with top research institutions, universities, and industry experts to bring his ideas to life. His ability to work effectively in multidisciplinary teams has led to the successful development and commercialization of several groundbreaking inventions.

Conclusion: James D Sampica's passion for innovation and his unwavering dedication to creating impactful solutions have solidified his reputation as a visionary inventor. His contributions continue to inspire future generations to push the boundaries of what is possible in the world of technology and beyond.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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